Journal of Materials Chemistry Cover by ITG

The April 7, 2009 edition of the Journal of Materials Chemistry (Vol. 19, Num. 13) features cover artwork created by ITG staff Janet Sinn-Hanlon. The cover imagery accompanies the feature article by UIUC researchers Zidong Wang and Yi Lu. The article summarizes recent progress in the development of biosensors by integrating functional DNA molecules with different types of nanomaterials, including metallic nanoparticles, semiconductor nanoparticles, magnetic nanoparticles, and carbon nanotubes.

Posted: 2009-05-13

ITG creates Advanced Materials Cover

The January 5, 2009 edition of Advanced Materials features 3D graphic artwork on its front cover created by ITG staff Steve Eisenmann. Eisenmann created the grahpic in the Visualization Laboratory. This image accompanies the feature article Direct Laser Writing of Photoresponsive Colloids for Microscale Patterning of 3D Porous Structures by Matthew C. George, Jennifer A. Lewis, and Paul V. Braun of the University of Illinois at Urbana-Champaign, Ali Mohraz of the University of California, Irvine, and Martin Piech and Nelson S. Bell of Sandia National Laboratories.

Posted: 2009-02-05

EE Times Cover by ITG

The September 22, 2008 edition of EE Times features an image created by ITG staff Chas Conway. The cover photograph accompanies an article describing a variety of recent advances in bendable, stretchable, high-performance integrated circuits by Beckman Institute faculty John Rogers, et al. The image was captured by Conway using the macro-photography system in the ITG Visualization Laboratory.

Posted: 2009-02-02

PNAS cover by ITG

The December 2, 2008 edition of the Proceedings of the National Academy of Sciences of the United States of America (PNAS) features a cover image created by ITG staff Chas Conway. Conway created and photographed the scene by constructing an intricate sample holder for the circuit and a combination of light sources. He used the ITG's Canon 1Ds Mark III digital SLR camera and macro-photography system in the VMIL. The cover imagery accompanies the PNAS feature article describing stretchable circuits titled Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations, by John A. Rogers, Dae-Hyeong Kim, Hoon-Sik Kim, and Rak-Hwan Kim of UIUC, Jizhou Song of University of Miami, Won Mook Choi of Samsung Advanced Institute of Technology, Zhuangjian Liu and Yong-wei Zhang of Institute of High Performance Computing, Yonggang Y. Huang of Northwestern University, and Keh-Chih Hwang of Tsinghua University.

Posted: 2008-12-30

ITG creates Advanced Materials Cover

The December 17, 2008 edition of Advanced Materials features a cover image created by ITG staff Steve Eisenmann and UIUC researcher Robert Shepherd. The cover artwork accompanies the feature article Stop-Flow Lithography of Colloidal, Glass, and Silicon Microcomponents by Robert F. Shepherd and Jennifer A. Lewis of UIUC, Priyadarshi Panda, T. Alan Hatton, and Patrick S. Doyle of Massachusetts Institute of Technology, and Zhihao Bao and Kenneth H. Sandhage of Georgia Institute of Technology. The cover image was created by Eisenmann and Shepherd using Maya software in the VMIL.

Posted: 2008-12-29

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